品牌:
Maxim Integrated (美信)(13)
Heraeus(6)
TE Connectivity (泰科)(3)
Melexis(9)
Honeywell (霍尼韦尔)(176)
Phoenix (菲尼克斯)(5)
Crouzet (高诺斯)(1)
Amphenol (安费诺)(4)
ADI (亚德诺)(17)
TDK (东电化)(4)
Measurement Specialties (精量电子)(3)
Panasonic (松下)(3)
NXP (恩智浦)(5)
Infineon (英飞凌)(1)
ATMEL (爱特美尔)(1)
TI (德州仪器)(11)
ST Microelectronics (意法半导体)(2)
Thermometrics(6)
Microchip (微芯)(3)
Digi International(1)
Omron (欧姆龙)(1)
White Rodgers(1)
DLP Design(1)
US Sensor(2)
多选
封装:
F5 MicroCan(3)
(80)
MODULE(30)
TO-46-4(2)
TO-39-4(7)
Cylinder with Mounting Flange(61)
Cylinder(29)
-(6)
Module, Terminal Block(5)
Probe(1)
TO-92-3(17)
SOP(2)
QSOP(3)
TSSOP(1)
SOD-70(1)
TO-92(3)
SOIC-8(2)
TO-46-3(6)
TO-226-3(4)
hermetically-sealed(1)
SOIC(1)
TO-5(1)
SSOP-16(1)
SIP(1)
SOT-23-6(1)
DO-35(1)
TSSOP-24(1)
0805(1)
MSOP-8(1)
Can(1)
DIP-4(1)
TO-18(1)
DIE(1)
Radial(2)
多选
包装:
Bulk(279)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空